Hi everyone. I’m starting this thread to log our progress and keep people updated with regards to the EtcherPro project. I’ll keep posting live updates so everyone interested in this product knows where we stand.
Our intention is to bring the product to the market as soon as possible. We thought we could start shipping products around the end of August but this doesn’t seem to be possible. We want to apologize for that and assure you that we are delaying the production only to make the product better. Our next big step is to test the device in an independent lab to ensure we comply with US, EU and UK regulations and obtain all relevant certifications. We have already placed bulk orders for components with long lead times and we’ll kickstart assembly once we validate the product. Our new estimation is that preorders will open around October aiming to start shipping devices before the end of the year.
Today we published an article that walks you through EtcherPro’s development journey, our design process and the problems we faced at each stage: Taming the ‘hard’ in hardware in 8 steps - a product development journey.
EtcherPro has received a lot of support and interest so far and we want to thank you for that!
We have received samples of the main PCB. We are happy with the quality but we need to make some minor changes to the design.
We have also received some samples of the card readers. The single card speed testing is great and we are waiting for more samples to be able to verify our speeds in scale.
The enclosure shells are ready and validated.
Within the next 2 weeks, we’ll receive production samples of the injection molded parts.
We are collecting all the necessary documentation to start the certification process. This takes around 2 months but it doesn’t stop us from starting the production in the meantime.
The BoM is complete and tested but it is crucial for us to validate the hardware performance. Once we verify we can deliver what we promised we’ll open pre-orders (around October) and we’ll order the rest of the components that have shorter lead times (packaging, standoffs, magnets, screens, etc)