We would love to see 2x ethernet ports, rs-485, and a metal case for better temp regulation.
Presumably this would be active POE so we don’t have to worry so much about the input power.
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Second the metal case. It is also important to us that all connectors be secure due to high vibration in our working environment.
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Could we get an estimated prototype date for the new Fin 2.0?
Stumbled on this:
Perhaps an inspiration for the Fin2
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Thank you @barryjump yes! this is pretty similar of what we want to do! Thank you for your feedback 
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Bluetooth 5.2 and/or a second expansion slot (mPCIe or M.2).
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Yes, double mpcie would be very very nice
Hi,
any news about the date when the product will be available ?
Regards
Hi,
any news from the team ?
Hi…Kind of - two Raspberry Pi 3B would likewise get two cameras, twice as many register centers, with a similar inactive current.
I have never arrived behind schedule of actual memory, (or seen trade go much above 5%), and am scarcely ready to utilize one camera up until this point. The “Balance” simply doesn’t appear to be a decent incentive, for “simple human” robots.
Increasing my broadly useful Pi 3B with a particular reason picture processor Hat - that seems like what’s to come
Received that Oratek Tofu board a few days ago and I can confirm it’s pretty nice. Very well made.
The only challenge is that it has an M.2 slot on the bottom (which is great for some) but I think a lot of us could use a full sized mpcie slot.
Still an excellent example of what Fin2.0 could be.
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Thank you for this 
I’ll switch to this board, because no delay an no news from the balena team.
Hello @hsd the balenaFin team is still working on the Fin 2.0.
I will ping them to send a new update meanwhile let us know how does it work the Tofu board for you with balena
Hello,
thank you for your answer.
Tofu is a really good hardware I think that lots of people could switch from balenafin to Tofu because 21 days to say “i’ll ping them” 
…
@hsd Revisiting this thread to provide a status; currently there are no updates on the Fin 2.0, due to limitations on the supply chain for the Compute Module 4, the work on this product has been forced to a halt. We’re currently working on a hardware solution to enable our customers to deploy existing devices (RPi3/4) with industrialised form factors but this is still in a very early prototype phase. We will of course provide more details about this as the solution formalises. Thanks for your patience!
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